JPS634331B2 - - Google Patents
Info
- Publication number
- JPS634331B2 JPS634331B2 JP55049686A JP4968680A JPS634331B2 JP S634331 B2 JPS634331 B2 JP S634331B2 JP 55049686 A JP55049686 A JP 55049686A JP 4968680 A JP4968680 A JP 4968680A JP S634331 B2 JPS634331 B2 JP S634331B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- dielectric ceramic
- electrodes
- electrode
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229940100890 silver compound Drugs 0.000 claims description 3
- 150000003379 silver compounds Chemical class 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 101710134784 Agnoprotein Proteins 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229910017937 Ag-Ni Inorganic materials 0.000 description 1
- 229910017984 Ag—Ni Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4968680A JPS56146218A (en) | 1980-04-15 | 1980-04-15 | Method of manufacturing dielectric ceramic electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4968680A JPS56146218A (en) | 1980-04-15 | 1980-04-15 | Method of manufacturing dielectric ceramic electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56146218A JPS56146218A (en) | 1981-11-13 |
| JPS634331B2 true JPS634331B2 (en]) | 1988-01-28 |
Family
ID=12838058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4968680A Granted JPS56146218A (en) | 1980-04-15 | 1980-04-15 | Method of manufacturing dielectric ceramic electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56146218A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10243569A1 (de) * | 2002-09-19 | 2004-04-01 | Infineon Technologies Ag | Schaltkreis-Anordnung und Verfahren zum Herstellen einer Schaltkreis-Anordnung |
-
1980
- 1980-04-15 JP JP4968680A patent/JPS56146218A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56146218A (en) | 1981-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63299223A (ja) | キヤパシタ端部ターミネーシヨン組成物及びターミネーシヨンの方法 | |
| CA1156802A (en) | Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith | |
| JPS5926662B2 (ja) | 無電解メッキ活性金属材料ペ−ストおよびそれを用いたメッキ方法 | |
| JPS634332B2 (en]) | ||
| JPH0616461B2 (ja) | チップ型積層磁器コンデンサ | |
| JPS634331B2 (en]) | ||
| JPS634327B2 (en]) | ||
| JPS629204B2 (en]) | ||
| JPH0136243B2 (en]) | ||
| JPS634329B2 (en]) | ||
| JPS634338B2 (en]) | ||
| JPS634330B2 (en]) | ||
| JP2996016B2 (ja) | チップ型電子部品の外部電極 | |
| JPS634336B2 (en]) | ||
| JP2574383B2 (ja) | セラミック電子部品の電極形成方法 | |
| JPS634328B2 (en]) | ||
| JPS634335B2 (en]) | ||
| JPS631726B2 (en]) | ||
| JPH0237117B2 (ja) | Kibannidodenkairookeiseisuruhoho | |
| JPS5926661B2 (ja) | 無電解メッキ活性金属材料ペ−ストおよびそれを用いたメッキ方法 | |
| JPS58161759A (ja) | アルミニウム基板のめつき方法 | |
| JPS631729B2 (en]) | ||
| JPS631730B2 (en]) | ||
| JPS6225748B2 (en]) | ||
| JPS6316897B2 (en]) |